MULTI-LEVEL SYSTEMS OF INTERCIRCUIT CONNECTION
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PURPOSE
Multi-level systems of intercircuit connection can serve as a basis or substrate for a wide range of electronic devices with an increased mechanical resistance, heat radiation and high resistance against electromagnetic radiations
TECHNICAL CHARACTERISTICS
| Min. width of conductors and leads between them, µm | 8...10 |
| Electric reliability of insulating coating, V/cm | 0,01 |
| Range of operating temperatures, К | 50...100 |
| Dielectric loss tangent | 1012 |
| Thermal conductivity, W/m·К | 2·105 |
| Thickness of insulating coating, µm | 10...2·105 |
| Thickness of free oxide film, µm | 200...750 |
ADVANTAGES
- planarity of surface relief
- high integration level
- reproducibility and high accuracy of geometrical topology sizes
- high dissipation power
- possibility to embed passive resistance and capacitor elements into metal coating
- high durability under mechanical, thermal and electromagnetic actions
- reproducibility of electrical parameters
- widened possibilities of topological layout design
DEVELOPER
R&D LAB 4.2 «Hybrid IC technology»
CONTACTS
6, P.Brovki str., 220013, Minsk, Republic of Belarus
☏ +375 17 293 88 50, +375 17 293 21 19
🖷 +375 17 292 96 28
🖂 sokol@bsuir.by
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