EXTENDED MAGNETRON SPUTTERING SYSTEMS OF MSPR-1000 SERIES
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PURPOSE
MSPR-1000 series magnetron sputtering systems are used in industrial units for vacuum ion-plasma thin films deposition and suitable for the semiconductor, metal and dielectric film deposition by DC, pulse MF (10 - 200 kHz) magnetron sputtering and reactive magnetron sputtering methods on large-scale substrates.
APPLICATION AREA
- DC magnetron sputtering
- MF pulse magnetron sputtering
- DC / MF reactive magnetron sputtering
TECHNICAL CHARACTERISTICS
Magnetic system | Sr-Fe-O permanent magnets |
Target size, mm | |
width | 100 |
length | up to 1000 * |
thickness | up to 12 |
Substrate size, mm | up to 500 ** |
DC discharge voltage, V | 300...600 |
DC discharge current, А | up to 10,0 |
Working gases |
inert or a mixture of inert and reactive gases (O2, N2 , CxHy) |
Gas flow rate, ml/min | 45...60 |
Working pressure, Pа | 0,06...1,0 |
Deposition rate (Al target), DC, nm/sec | 1 |
Magnetron dimensions, mm | 665x144x72 *** |
Weight, кg, not more | 25,0 *** |
* on the Customer’s request the target size may be changed in the range from 200 up to 1000 mm
** for a target length of 610 mm for the preset nonuniformity of film thickness ± 10%
*** for a target length of 610 mm
ADVANTAGES
- magnetron system is made on Nd-Fe-B magnets
- indirect cooling of the target and magnets
- copper body of the cathode accounts for good cooling of the target and the magnetic system
- magnetron is located in the vacuum chamber and can be easily readjusted in any position
- integrated gas supply
DEVELOPER
Center 2.1 "Plasma Processing Research Center"
CONTACTS
6, P. Brovki str., 220013, Minsk, Republic of Belarus
☏ +375 17 293 80 79, +375 17 293 88 35
🖷 +375 17 293 88 35
🖂 svad@bsuir.by ; szavad@bsuir.by
🌐 plasma.bsuir.by
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