EXTENDED MAGNETRON SPUTTERING SYSTEMS OF MSPR-1000 SERIES



 

 

 

 

 

 

PURPOSE

MSPR-1000 series magnetron sputtering systems are used in industrial units for vacuum ion-plasma thin films deposition and suitable for the semiconductor, metal and dielectric film deposition by DC, pulse MF (10 - 200 kHz) magnetron sputtering and reactive magnetron sputtering methods on large-scale substrates. 

 

APPLICATION AREA

  • DC magnetron sputtering
  • MF pulse magnetron sputtering
  • DC / MF reactive magnetron sputtering

 

TECHNICAL CHARACTERISTICS 

Magnetic system                                                                                                                       Sr-Fe-O permanent magnets
Target size, mm  
width 100
length up to 1000 *
thickness  up to 12
Substrate size, mm up to 500 **
DC discharge voltage, V 300...600
DC discharge current, А up to 10,0
Working gases inert or a mixture of inert and
reactive gases (O2, N2 , CxHy)
Gas flow rate, ml/min 45...60
Working pressure, Pа 0,06...1,0
Deposition rate (Al target), DC, nm/sec 1
Magnetron dimensions, mm 665x144x72 ***
Weight, кg, not more 25,0 ***


* on the Customer’s request the target size may be changed in the range from 200 up to 1000 mm
** for a target length of 610 mm for the preset nonuniformity of film thickness ± 10%
*** for a target length of 610 mm


ADVANTAGES

  • magnetron system is made on Nd-Fe-B magnets
  • indirect cooling of the target and magnets
  • copper body of the cathode accounts for good cooling of the target and the magnetic system
  • magnetron is located in the vacuum chamber and can be easily readjusted in any position
  • integrated gas supply

 

DEVELOPER

Center 2.1 "Electronic technologies and engineering diagnostics of process media and solid-state structures"

 

CONTACTS

6, P. Brovki str., 220013, Minsk, Republic of Belarus
☏  +375 17 293 80 79, +375 17 293 88 35 
🖷  +375 17 293 88 35
🖂   svad@bsuir.by ; szavad@bsuir.by
🌐  plasma.bsuir.by

 

OTHER INNOVATIONS IN THIS AREA

ION SOURCES

PLASMA ELECTRON SOURCE FOR ION BEAM NEUTRALIZATION

MAGNETRON SPUTTERING SYSTEMS

SYSTEM FOR DIAGNOSTIC PARAMETERS

PROGRAM COMPLEX FOR SIMULATION «DEPOSITION»