MAGNETRON SPUTTERING SYSTEMS OF MARS-100 SERIES



 

 

 

 

 

 

PURPOSE

Magnetron sputtering system of ARS-100 series is used in the technology of vacuum ion-plasma thin-film deposition and intended for thin-film deposition of metals, semiconductors, and their compounds by DC, and pulsed MF (10 – 200 kHz) magnetron sputtering and reactive magnetron sputtering methods.

 

APPLICATION AREA

  • DC magnetron sputtering
  • pulsed MF magnetron sputtering
  • DC reactive magnetron sputtering
  • pulsed reactive magnetron sputtering

 

TECHNICAL CHARACTERISTICS 

Discharge voltage, V                                                                                                        300...600
Discharge current, up to 5,0
Working gases rare or mixture of rare and reactive
gases (O2, N2 , CxHy)
Gas consumption, ml/min up to 50
Working pressure, P 0,05...1,0
Target size, mm Ø 100 (target thickness 1-6 mm)*
Substrate size, mm 60x60 **
Deposition rate (Al target), nm/sec up to 20
Dimensions of the magnetron, mm Ø 140x105
Weight, g, not more 5,0


* on the Customer’s request the target size may be changed in the range from 60 up to 170 mm
** for the preset film thickness nonuniformity of ±10 % at the distance of 60 mm from the target surface


ADVANTAGES 

  • magnetron system is based on Sr-Fe-O permanent magnets
  • direct water cooling of the magnetic system
  • target cooling is performed with running water through a thin copper membrane, which is snug against the target under water pressure. This reduces the heat-transfer resistance of the target-cathode system and makes it possible to operate under high discharge powers
  • direct target cooling is possible
  • integrated gas supply system

 

DEVELOPER

Center 2.1 "Electronic technologies and engineering diagnostics of process media and solid-state structures"

 

CONTACTS

6, P. Brovki str., 220013, Minsk, Republic of Belarus
☏  +375 17 293 80 79, +375 17 293 88 35 
🖷  +375 17 293 88 35
🖂   svad@bsuir.by ; szavad@bsuir.by
🌐  plasma.bsuir.by

 

OTHER INNOVATIONS IN THIS AREA

ION SOURCES

PLASMA ELECTRON SOURCE FOR ION BEAM NEUTRALIZATION

MAGNETRON SPUTTERING SYSTEMS

SYSTEM FOR DIAGNOSTIC PARAMETERS

PROGRAM COMPLEX FOR SIMULATION «DEPOSITION»