MAGNETRON SPUTTERING SYSTEMS OF MARS-100 SERIES
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PURPOSE
Magnetron sputtering system of МARS-100 series is used in the technology of vacuum ion-plasma thin-film deposition and intended for thin-film deposition of metals, semiconductors, and their compounds by DC, and pulsed MF (10 – 200 kHz) magnetron sputtering and reactive magnetron sputtering methods.
APPLICATION AREA
- DC magnetron sputtering
- pulsed MF magnetron sputtering
- DC reactive magnetron sputtering
- pulsed reactive magnetron sputtering
TECHNICAL CHARACTERISTICS
| Discharge voltage, V | 300...600 |
| Discharge current, А | up to 5,0 |
| Working gases |
rare or mixture of rare and reactive gases (O2, N2 , CxHy) |
| Gas consumption, ml/min | up to 50 |
| Working pressure, Pа | 0,05...1,0 |
| Target size, mm | Ø 100 (target thickness 1-6 mm)* |
| Substrate size, mm | 60x60 ** |
| Deposition rate (Al target), nm/sec | up to 20 |
| Dimensions of the magnetron, mm | Ø 140x105 |
| Weight, кg, not more | 5,0 |
* on the Customer’s request the target size may be changed in the range from 60 up to 170 mm
** for the preset film thickness nonuniformity of ±10 % at the distance of 60 mm from the target surface
ADVANTAGES
- magnetron system is based on Sr-Fe-O permanent magnets
- direct water cooling of the magnetic system
- target cooling is performed with running water through a thin copper membrane, which is snug against the target under water pressure. This reduces the heat-transfer resistance of the target-cathode system and makes it possible to operate under high discharge powers
- direct target cooling is possible
- integrated gas supply system
DEVELOPER
Center 2.1 "Plasma Processing Research Center"
CONTACTS
6, P. Brovki str., 220013, Minsk, Republic of Belarus
☏ +375 17 293 80 79, +375 17 293 88 35
🖷 +375 17 293 88 35
🖂 svad@bsuir.by ; szavad@bsuir.by
🌐 plasma.bsuir.by
OTHER INNOVATIONS IN THIS AREA
PLASMA ELECTRON SOURCE FOR ION BEAM NEUTRALIZATION