RF/DC MAGNETRON SPUTTERING SYSTEM MIRAGE-010.080
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PURPOSE
The DC/RF magnetron sputtering system МIRAGE-080.010 is used in the technology of vacuum-plasma thin-film deposition and intended to deposit layers of metals, semiconductors and dielectrics by methods of DC, RF (13.56 MHz), pulsed MF (10 – 200 kHz) magnetron sputtering, and reactive magnetron sputtering.
APPLICATION AREA
- DC magnetron sputtering
- pulsed MF magnetron sputtering
- RF magnetron sputtering
- DC/RF reactive magnetron sputtering
- pulsed reactive magnetron sputtering
TECHNICAL CHARACTERISTICS
| Magnetic system | Nd-Fe-B permanent magnets |
| Target size, mm | Ø 80 (target thickness 1-6 mm) * |
| Substrate size, mm | 60x60 ** |
| Discharge voltage (DC), V | 300...600 |
| Discharge current (DC), А | up to 3,0 |
| RF discharge power (13,56 MHz), W | up to 600 |
| Working gases |
rare or mixture of rare and reactive gases (O2, N2 , CxHy) |
| Gas consumption, ml/min | 45...60 |
| Operating pressure, Pа | 0,06...1,0 |
| Deposition rate (Al target), nm/sec | |
| DC 1 kW | up to 20,0 |
| RF (13.56 MHz, 600 W) | up to 2,5 |
| Dimensions of the magnetron, mm | Ø 127x80 |
| Weight, кg, not more | 5,0 |
* on the Customer’s request the target size may be changed in the range from 50 up to 170 mm
** for the preset film thickness nonuniformity of ±10 %
ADVANTAGES
- magnetic system is made on Nd-Fe-B magnets
- indirect cooling of the target and magnets
- copper body of the cathode accounts for good cooling of the target and the magnetic system
- magnetron is installed in the vacuum chamber and can be easily readjusted in any position
- integrated gas supply system
DEVELOPER
Center 2.1 "Plasma Processing Research Center"
CONTACTS
6, P. Brovki str., 220013, Minsk, Republic of Belarus
☏ +375 17 293 80 79, +375 17 293 88 35
🖷 +375 17 293 88 35
🖂 svad@bsuir.by ; szavad@bsuir.by
🌐 plasma.bsuir.by
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