RF/DC MAGNETRON SPUTTERING SYSTEM MIRAGE-010.080



 

 

 

 

 

 

PURPOSE

The DC/RF magnetron sputtering system ÌIRAGE-080.010 is used in the technology of vacuum-plasma thin-film deposition and intended to deposit layers of metals, semiconductors and dielectrics by methods of DC, RF (13.56 MHz), pulsed MF (10 – 200 kHz) magnetron sputtering, and reactive magnetron sputtering. 

 

APPLICATION AREA

  • DC magnetron sputtering
  • pulsed MF magnetron sputtering
  • RF magnetron sputtering
  • DC/RF reactive magnetron sputtering
  • pulsed reactive magnetron sputtering

 

TECHNICAL CHARACTERISTICS 

Magnetic system                                                                                                                       Nd-Fe-B permanent magnets
Target size, mm Ø 80 (target thickness 1-6 mm) *
Substrate size, mm 60x60 **
Discharge voltage (DC), V 300...600
Discharge current (DC), À up to 3,0
RF discharge power (13,56 MHz), W up to 600
Working gases rare or mixture of rare and reactive gases
(O2, N2 , CxHy)
Gas consumption, ml/min 45...60
Operating pressure, Pà 0,06...1,0
Deposition rate (Al target), nm/sec   
DC 1 kW up to 20,0
RF (13.56 MHz, 600 W) up to 2,5
Dimensions of the magnetron, mm Ø 127x80
Weight, êg, not more 5,0


* on the Customer’s request the target size may be changed in the range from 50 up to 170 mm
** for the preset film thickness nonuniformity of ±10 %


ADVANTAGES

  • magnetic system is made on Nd-Fe-B magnets
  • indirect cooling of the target and magnets
  • copper body of the cathode accounts for good cooling of the target and the magnetic system
  • magnetron is installed in the vacuum chamber and can be easily readjusted in any position
  • integrated gas supply system

 

DEVELOPER

Center 2.1 "Ion Plasma Systems and Technologies"

 

CONTACTS

6, P. Brovki str., 220013, Minsk, Republic of Belarus
☏  +375 17 293 80 79, +375 17 293 88 35 
🖷  +375 17 293 88 35
🖂   svad@bsuir.by ; szavad@bsuir.by
🌐  plasma.bsuir.by

 

OTHER INNOVATIONS IN THIS AREA

ION SOURCES

PLASMA ELECTRON SOURCE FOR ION BEAM NEUTRALIZATION

MAGNETRON SPUTTERING SYSTEMS

SYSTEM FOR DIAGNOSTIC PARAMETERS

PROGRAM COMPLEX FOR SIMULATION «DEPOSITION»